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motorola semiconductor technical data order number: mpxaz6115a rev. 1, 06/2004 ? motorola, inc. 2004 media resistant and high temperature accuracy integrated silicon pressure sensor for measuring absolute pressure, on-chip signal conditioned, temperature compensated and calibrated motorola's mpxaz6115a seri es sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networ ks to provide a high output signal and temperature compensation. the sensor's packaging has been designed to provide resistance to high humidity conditions as well as common automotive media. the small form factor and high reliability of on-chip integration make the motorola pressure sensor a logica l and economical choice for the system designer. the mpxaz6115a series piezoresistive transducer is a state-of-the-art, monolithic, signal conditio ned, silicon pressure sensor. this sensor combines advanced micromachining techniques, th in film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. figure 1 shows a block diagram of the inte rnal circuitry integrated on a pressure sensor chip. features ? resistant to high humidity and common automotive media ? improved accuracy at high temperature ? 1.5% maximum error over 0 to 85 c ? ideally suited for microprocessor or microcontroller-based systems ? temperature compensated from -40 to +125 c ? durable thermoplastic ( pps) surface mount package application examples ? aviation altimeters ? industrial controls ? engine control/manifold absolute pressure (map) ? weather station and weather reporting devices figure 1. fully integrated pressure sensor schematic mpxaz6115a MPXHZ6115A series mpxaz6115a6u case 482-01 integrated pressure sensor 15 to 115 kpa (2.2 to 16.7 psi) 0.2 to 4.8 volts output small outline package mpxaz6115ac6u case 482a-01 MPXHZ6115A6u case 1317-04 super small outline package mpxaz6115ac6u case 1317a-03 5 6 7 8 n/c v s gnd v out n/c n/c n/c pin number 1 2 3 4n/c note: pins 1, 5, 6, 7, and 8 are internal device connections. do not connect to external circuitry or ground. pin 1 is denoted by the notch in the lead. v s sensing element v out gnd thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry pins 1, 5, 6, 7 and 8 are no connects f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
mpxaz6115a MPXHZ6115A series mpxaz6115a motorola sensor device data 2 notes: 1. exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. maximum output current is controlled by effective impedance from v out to gnd or v out to v s in the application circuit. notes: 1. device is radiometric within this specifi ed excitation range. 2. offset (v off ) is defined as the output voltage at the minimum rated pressure. 3. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. 4. full scale span (v fss ) is defined as the algebraic difference between the output vo ltage at full rated pressure and the output voltage at the minimum rated pressure. 5. accuracy is the deviation in actual out put from nominal output over the entire pressure range and temperature range as a perc ent of span at 25 c due to all sources of error including the following: ? linearity: output deviation from a stra ight line relationship with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operati ng temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 c. ? tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum pressu re applied, over the temperature range of 0 to 85 c, relative to 25 c. 6. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 7. warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. offset stability is the product's output dev iation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test. maximum ratings (1) parametrics symbol value units maximum pressure (p1 > p2) p max 400 kpa storage temperature t stg -40 to +125 c operating temperature t a -40 to +125 c output source current @ full scale output (2) i o + 0.5 madc output sink current @ minimum pressure offset (2) i o - -0.5 madc operating characteristics (v s = 5.0 vdc, t a = 25 c unless otherwise noted, p1 > p2.) characteristic symbol min typ max unit pressure range p op 15 - 115 kpa supply voltage (1) v s 4.75 5.0 5.25 vdc supply current i o - 6.0 10 madc minimum pressure offset (2) (0 to 85 c) @ v s = 5.0 volts v off 0.133 0.200 0.268 vdc full scale output (3) (0 to 85 c) @ v s = 5.0 volts v fso 4.633 4.700 4.768 vdc full scale span (4) (0 to 85 c) @ v s = 5.0 volts v fss 4.433 4.500 4.568 vdc accuracy (5) (0 to 85 c) - - - 1.5 %v fss sensitivity v/p - 45.9 - mv/kpa response time (6) t r - 1.0 - ms warm-up time (7) - - 20 - ms offset stability (8) - - 0.25 - %v fss f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
mpxaz6115a MPXHZ6115A series motorola sensor device data mpxaz6115a 3 figure 2. cross sectional diagram sop (not to scale) figure 2 illustrates the absolute sensing chip in the basic small outline chip carrier (case 482). figure 3. typical application circuit (output source current operation) figure 3 shows a typical application circuit (output source current operation). figure 4. output versus absolute pressure figure 4 shows the sensor output signal relative to pressure input. typical minimum and maximum output curves are shown for operation over 0 to 85 c temperature range. the output will saturate outside of the rated pressure range. a gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. the gel die coat and durable polymer package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. contact the factory for more information regarding media compatibility in your specific application. wire bond stainless steel cap thermoplastic case die bond sealed vacuum reference die p1 gel die coat lead frame absolute element v s pin 2 +5.0 v gnd pin 3 v out pin 4 mpxaz6115a to adc 100 nf 51 k 47 pf output (volts) 5.0 4.5 4.0 3.5 3.0 pressure (ref: to sealed vacuum) in kpa 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 2.5 2.0 1.5 1.0 0.5 0 110 115 120 transfer function: v out = v s * (.009*p-.095) error v s = 5.0 vdc temp = 0 to 85 c max typ min f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
mpxaz6115a MPXHZ6115A series mpxaz6115a motorola sensor device data 4 ordering information? small outline package device type options case no. mpx series order no. packing options marking basic element absolute, element only 482 mpxaz6115a6u rails mpxaz6115a absolute, element only 482 mpxaz6115a6t1 tape and reel mpxaz6115a ported element absolute, axial port 482a mpxaz6115ac6u rails mpxaz6115a absolute, axial port 482a mpxaz6115ac6t1 tape and reel mpxaz6115a ordering information?su per small outline package device type options case no. mpx series order no. packing options marking basic element absolute, element only 1317 MPXHZ6115A6u rails MPXHZ6115A absolute, element only 1317a MPXHZ6115A6t1 tape and reel MPXHZ6115A ported element absolute, axial port 1317a MPXHZ6115Ac6u rails MPXHZ6115A absolute, axial port 1317a MPXHZ6115Ac6t1 tape and reel MPXHZ6115A nominal transfer value: v out = v s x (0.009 x p - 0.095) (pressure error x temp. factor x 0.009 x v s ) v s = 5.0 0.25 vdc transfer function (mpxaz6115a) mpxaz6115a series break points temp multiplier - 40 3 0 to 85 1 125 1.75 temperature in c 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 140 120 100 80 temperature error factor note: the temperature multiplier is a linear response from 0 c to -40 c and from 85 c to 125 c temperature error band error limits for pressure 3.0 2.0 1.0 -1.0 -2.0 -3.0 0.0 20 pressure (in kpa) pressure error (kpa) pressure error (max) 15 to 115 (kpa) 1.5 (kpa) 40 60 80 100 120 pressure error band f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
mpxaz6115a MPXHZ6115A series motorola sensor device data mpxaz6115a 5 surface mounting information minimum recommended footprin t for small outline package surface mount board layout is a critical portion of the total design. the footprint for the se miconductor package must be the correct size to ensure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self-align when subjected to a solder reflow process. it is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. figure 5. sop footprint (case 482 and 482a) minimum recommended footprint for super small outline packages surface mount board layout is a critical portion of the total design. the footprint for the se miconductor package must be the correct size to ensure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self-align when subjected to a solder reflow process. it is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. figure 6. ssop footprint (case 1317 and 1317a) 0.660 16.76 0.060 typ 8x 1.52 0.100 typ 8x 2.54 0.100 typ 2.54 0.300 7.62 inch mm 0.027 typ 8x 0.69 0.053 typ 8x 1.35 inch mm 0.387 9.83 0.150 3.81 0.050 1.27 typ f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
mpxaz6115a MPXHZ6115A series mpxaz6115a motorola sensor device data 6 small outline package dimensions case 482-01 issue o s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a s t -a- -b- n c m j k pin 1 identifier h seating plane -t- dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 5.38 0.230 0.212 5.84 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.405 0.415 10.29 10.54 s 0.709 0.725 18.01 18.41 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. pin 1 identifier h seating plane -t- w case 482a-01 issue a c m j k v dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a t -a- -b- n s f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
mpxaz6115a MPXHZ6115A series motorola sensor device data mpxaz6115a 7 super small outline package dimensions detail d gage plane 0.038 0.010 .014 0.002 0.048 10? 0? case 1317-04 issue d 0.025 0.050 a m 0.004 b c 0.280 a b a 0.006 b c 8x 0.014 2x 0.019 0.300 0.280 0.300 0.400 0.420 3 5 3 0.298 0.165 c 0.004 detail d seating plane 0.278 0.145 notes: 1. all dimensions are in inches. 2. dimensioning and tolerancing per asme y14.5m-1994. 3. dimensions do not include mold flash or protrusions. mold flash or protrusions shall not exceed .006 inches per side. 4. all vertical surfaces to be 5? maximum. 5. dimension does not include dambar protrusion. allowable dambar protrusion shall be .008 inches maximum. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
mpxaz6115a MPXHZ6115A series mpxaz6115a motorola sensor device data 8 super small outline package dimensions gage plane detail e 0.048 0.010 .014 0.002 0.038 10? 0? case 1317a-03 issue a 0.025 0.050 0.025 a m 0.004 b c a 0.006 b c 8x 2x 0.014 0.018 0.325 0.345 0.325 0.345 0.400 0.420 5 0.130 c 0.004 detail e seating plane 0.110 0.390 0.370 0.200 0.180 notes: 1. all dimensions are in inches. 2. dimensioning and tolerancing per asme y14.5m-1994. 3. dimensions do not include mold flash or protrusions. mold flash or protrusions shall not exceed .006 inches per side. 4. all vertical surfaces to be 55 maximum. 5. dimension does not include dambar protrusion. allowable dambar protrusion shall be .008 inches maximum. a b 0.280 0.300 0.280 0.300 3 bottom view 3 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
mpxaz6115a MPXHZ6115A series motorola sensor device data mpxaz6115a 9 notes f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
mpxaz6115a MPXHZ6115A series mpxaz6115a motorola sensor device data 10 notes f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
mpxaz6115a MPXHZ6115A series motorola sensor device data mpxaz6115a 11 notes f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
how to reach us : usa/europe/locations not listed : japan : motorola japan ltd.; sps, technical information center motorola literature distribution 3-20-1 mi nami-azabu. minato-ku, tokyo 106-8573, japan p.o. box 5405, denver, colorado 80217 81-3-3440-3569 1-800-521-6274 or 480-768-2130 asia/pacific: motorola semiconductors h.k. ltd.; silicon harbour centre 2 dai king street, tai po industrial estate, tai po, n.t., hong kong 852-26668334 home page: http://motorola.com/semiconductors mpxaz6115a information in this document is provided solely to enable system and software implementers to use motorola products. there are no express or implied copyright licenses granted hereunder to desi gn or fabricate any integrated circuits or integrated circuits based on the informa tion in this document. motorola reserves the right to make changes without further notic e to any products herein. motorola makes no warranty, represen tation or guarantee regarding the suitability of its products for any particular purp ose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, in cluding without limitation consequential or incidental damages. ?typical? parameters which may be provided in motorola data sheets and/or spec ifications can and do vary in different applications and actual performance may var y over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as compon ents in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the motorola product could create a situation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its officers, employees, s ubsidiaries, affiliates, and di stributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of persona l injury or death associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufa cture of the part. motorola and the stylized m logo are registered in the us patent and trademark office. all other product or service names are t he property of their respective owners. ? motorola, inc. 2004 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .

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